Mask aligner
C to C is auto batch scale exposure mask alignment equipment.
It conducts gap management without any contact with the mask.
Of course, it is also capable of soft and hard contact!
Compact and low cost auto alignment is now possible.
Three features
- 1Parallelism correction and exposure without any contact
High accuracy laser displacement meter handles parallelism correction,
and performs exposure without contact, so the mask is not damaged! - 2Space saving and low maintenanceWith small robots space saving, at just 1m x 1m in size.
What’s more, the center robot layout makes maintenance a breeze. - 3Auto alignmentImage processing by FAST, a brand you can trust for high accuracy auto alignment!
Comparison with old design
- Old design
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Three points of damage to the gap ball!
- ASAP design
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Gap ball control with no contact whatsoever, allows for parallelism control
Contactless design prevents damage to mask and wafers!
- Exposure capacity
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Conditions
- Substrate:Si (HMDS treatment)
- Film Thinckness:0.8um (OFPR-800LB)
- Prebake:90℃/90s
- Developer:NMD-3 (2.38%)
- RInse:DI water/20s
(Image is for illustration purposes only. Results may vary depending on conditions.)
- Primary specifications
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- Wafer sizeMAX8"
- Mask sizeMAX9"
- Exposureproximity (gap adjustment range 0-999um)
- Illuminance uniformity±5%
- Exposure controlintegral light meter or timer setting
- Image processing system2 million pixel CCD + image processing engine by FAST
- Wafer stageUVW3 axis stage + Z axis + tilt 2 axis format
- Basic features
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- Resolutionfor 20umGAP: Under 5um
- Alliant accuracywithin ±1um
- Throughputrobot conveyance type : 120wph
